Important information for IEDMS2022 accepted Authors:

For Oral Papers:

  • The allotted time for oral presentation is 25 minutes for invited speakers and 12 minutes (including presentation and question) for regular oral speakers.
  • Check the date, session and presentation time of your papers listed in the website of Preliminary Technical Program.
  • Please upload your Letter of Authorization in PDF and presentation file in PDF (for backup use only) to the website of submission.
  • Please report to the Session Chair in the session room at least 20 minutes before the session begins.

For accepted Poster Presentation:

  • The usable space of the display boards is A1 size.
  • Posters should be readable by viewers from up to 1 meter away.
  • The paper ID number of each poster and of its corresponding poster board is given in the appropriate session program. Please be sure to set-up your poster on the appropriate poster board 30 minutes before the session begins.
  • Please upload your Letter of Authorization in PDF to the website of submission
  • Please dismantle your poster right after the session.

Registration for the Conference

  • At least one author of the accepted paper must register for the conference by 22 October 2022 12:00pm (EST), otherwise the paper will be withdrawn.
  • For non-student authors presenting multiple papers, one FULL or LIMITED registration is valid for up to two
  • Please be reminded to complete registration process as soon as possible, the deadline of registration is on 22 October 2022. Early Bird Registration is offered until 11 October 2022.

Best Paper Awards will be announced at Closing Remark on 28 October.

Please check the website: https://www.iedms2022.ncnu.edu.tw/  for transportation and hotel information.
Accommodation and Transportation Questionnaire:
https://forms.gle/bj9FfvCgKQWnTDZUA

國立暨南國際大學

2022年電子元件暨材料國際研討會

會議日期

10月27-28日,2022

各位學者專家:

2022電子元件暨材料國際研討會(IEDMS2022)將於2022年10月27-28日在國立暨南國際大學舉行。會議將提供全球的研究員、科學家、工程師以及業界一個討論平台,介紹他們在半導體元件和材料上的最新研究、構想、發展和應用。研討會內容包含口頭報告和海報展示及解說。

會議主題

議題A:化合物半導體材料與元件

議題B:矽相關製程、元件和積體電路整合

議題C:新型材料、醫療元件、大面積電子產品及相關產品應用材料製程、薄膜晶體管、二維半導體元件、熱電元件、模擬和可靠性

議題D:光子材料/元件,新型元件概念和應用